AMD (Advanced Micro Devices) AM29LV256ML109PGI Mfr Package Description: 18 X 12 MM, 1 MM PITCH, FORTIFIED, BGA-64 Package Shape: RECTANGULAR Package Style: GRID ARRAY, LOW PROFILE Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 1 mm Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 64 Package Body Material: PLASTIC/EPOXY Temperature Grade: INDUSTRIAL Memory Width: 16 Organization: 16M X 16 Memory Density: 2.68E8 deg Operating Mode: ASYNCHRONOUS Number of Words: 1.68E7 words Number of Words Code: 16M Alternate Memory Width: 8 Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 3.6 V Supply Voltage-Min (Vsup): 2.7 V Supply Voltage-Nom (Vsup): 3 V Memory IC Type: FLASH 3V PROM Parallel/Serial: PARALLEL Access Time-Max (tACC): 100 ns